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Facilities

Included in MC2 are the Transmission Electron Microscopy (TEM) Facility, Scanning Electron Microscopy (SEM) Facility, Light Optical Microscopy (LOM) Facility and X-Ray Diffraction (XRD) Facility.

The TEM Facility contains a FEI/Philips CM-20 conventional TEM equipped with an EDAX EDS system.

The SEM Facility contains a Schottky thermal field emission FEI/Philips XL-30 SEM equipped with back scattered electron detector and energy-dispersive X-ray spectometer (EDS).

The LOM Facility includes two Nikon Epiphot microscopes for reflect light microscopy, and one Nikon Optiphto-Pol for transmitted and polarized light microscopy. All of these microscopes can be connected to the Olympus digital camera and the SIS image analysis system. The facility is also equipped with a UMAX PowerLook 3000 high resolution scanner that has the capability to scan either negative or positive images.

The XRD Facility contains a Siemens/Bruker D-5000 powder diffractometer equipped with modern software for qualitative and semi-quantitative analyses.

In addition, the Center also equipped with a specimen preparation facility and a dark room facility. The following list summarizes the instruments and equipment currently available at the Center.

Regulations for reservations are listed in the Center Rules. User wishes to use the facility need to complete the application form and obtain approval by his/her advisor and the Center director.

Instrumentation

Electron Microscopy Facility
1. Philips CM 20 TEM with EDS (EDAX/4pi) system
2. Philips XL-30 field emission gun SEM with EDS (EDAX) system

Electron Microscopy Sample Preparation Facility
1. SBT (South Bay Technology) low speed saw
2. Buehler Simplimet III mounting press
3. Buehler Ecomet III variable speed grinder-polish
4. Buehler Economet III grinder/polisher
5. Buehler Miniment polisher
6. South Bay Technology Model 350 coring device
7. VCR Group/SBT D-500i dimpler
8. VCR/Ion Tech ion milling system (with liquid nitrogen stage)
9. Gatan Model 600DIF DuoMill
10. Struers Tenuupol-3 double-jet electro-polisher
11. EA Fishione twin-jet electro-polisher
12. VG/Polaron SC 7620 sputter coater
13. Pelco PAC-1 advanced coater (Model 9500)
14. National vacuum oven (Model 5851)
15. Sorvall MT-2 Ultrmicrotomes

X-Ray Diffraction Facility
1. Siemens/Bruker D5000 XRD (X-ray Diffractometer)

Optical Microscopy Facility
1. Nikon Epiphot reflected light optical microscope (2)
2. Nikon Optiphot -POL transmitted light optical microscope
3. Microfire 12-Bit color digital camera
4. Olympus/SIS materials suite (software)

Dark Room Facility
1. Photographic darkroom for film and plate processing and printing
2. Omega photographic enlarger
3. Polaroid MP-4 Land camera stand
4. California stainless (Mfg.) film dryer
5. Umax Powerlook 3000 professional scanner

   
Materials Characterization Center  |  The Henry Samueli School of Engineering  |  University of California, Irvine
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